Wide band gap (WBG) semiconductors are delivering on the promise of higher power and energy density circuits. In doing so, they are also opening an opportunity for a new generation of dielectric materials. Researchers from the University of Texas at Austin organized a 1.5 day workshop on "Next-generation dielectric materials for microelectronics/electrical applications" at the Massachusetts Institute Technology on December 4-5, 2019 focusing on this emerging opportunity. The invitationonly workshop brought together the materials researchers with those attempting to improve power electronics (PE) packaging to compare information that would accelerate the field.
IEEE Electrical Insulation Magazine
New Materials for Emerging Electrical Environments - Workshop Report
Electrification, particularly transportation electrification, is placing a premium on higher power and energy density. Increasing the power and energy density reduces the parasitic mass, making electrified vehicles more attractive. An enabling technology to meet this need is the development of wide band gap (WBG) semiconductors. WBGs enhance power and energy density by operating at higher temperatures, voltages, and frequencies than legacy semiconductors. While this capability enables new applications, it also poses considerable challenges, since this new operating environment can significantly reduce system life.
Presentations
Dielectric Materials for Wide Bandgap Semiconductor Thermal Management
Presented by Samuel Graham
Dielectrics for Power Electronics Applications
Presented by Paul Paret
Light/Heat-Curable Composite Materials as Dielectric Encapsulants for Next Generation Band Gap
Presented by Chris Orilall and Neal Pfeiffengerger
Molecular Engineered Polymer with High Thermal Conductivity
Presented by Gang Chen
Nano Brick Wall Thin Films
Presented by Jaime C. Grunlan
Nanodielectrics: Tailoring Dispersion to Optimize Properties
Presented by Linda S. Schadler
Plasmonic-Polymeric Nanoantennas: A New Material to Dissipate Thermal/Mechanical Energy?
Presented by Christy Landes and Stephan Link
3D Multiphysics Modeling of WBG-based Power Electronics Packaging
Presented by Hamid Ouroua
Synopsis: State of the Art Dielectric Materials (for packaging)
Presented by Vaibhav Bahadur